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Important Dates
  • Paper submission due:

    December 31, 2026

  • Paper acceptance due:

    January 31, 2027

  • Registration deadline:

    February 28, 2027

  • Conference date:

    April 9-11, 2027

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About

2027 International Conference on Data Engineering and Intelligent Systems (DEIS 2027) will take place in Hangzhou, China, from 9-11, 2027.

DEIS 2027 focuses on cutting-edge advances in big data engineering, artificial intelligence and practical deployment of intelligent systems. As an international academic event, it brings together scholars from global universities, research institutions and high-tech enterprises. Aligned with the development trends of digital economy and next-generation information technologies, the conference builds an international platform for industry-university-research collaboration. It addresses theoretical innovations and practical engineering challenges covering the full lifecycle of data processing and intelligent systems, facilitating in-depth academic exchanges and technical cooperation among worldwide researchers and engineering practitioners.

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